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TS EN 61190-1-1 Fastening materials for electronic assembly - part 1-1: Characteristics of solder paste used for high quality interconnections in electronic assemblies
Tests for environmental resistance - Part 60068-2: Tests - Test Td: Solderability of surface-mounted elements (SMD), test methods for resistance to metal coating deterioration and soldering temperature
TS EN 60194 Printed circuit board design, manufacturing and installation - Terms and definitions
TS EN 61190-1-3 / A1 Connection materials for electronic assembly - Part 1-3: Requirements for flux and flux solid soldering for electronic components and solder alloys suitable for electronic components
TS EN 61193-3 Quality assessment systems - Part 3: Selection and use of sampling plans for inspection of printed circuit board and laminate end product and process
60068-2-58 Tests for environmental resistance - Section 2-58: Tests - Test TD: Solderability of surface mounting elements (forging) Test methods for resistance to metallic properties and soldering temperature
Tests for resistance to environmental conditions - Section 60068-2: Tests - Test Tee: Solderability of electronic components for surface-mounted elements (SMD) by soldering stability method
TS EN 61191-1 Printed circuit installations - Part 1: General standard - Requirements for soldered electrical and electronic installations using surface-mounted and related installation technologies
TS EN 62739-1 Test method for erosion in corrugated soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for non-surface treated metal materials
TS EN 61191-2 Printed circuit units - Part 2: Part feature: Requirements for the surface mounted on soldered units
TS EN 61190-1-2 Fastening materials for electronic assembly - Part 1-2: Rules for solder paste used in high-quality interconnections in electronic assembly
TS EN 62137-4 Electronic assembly technology - Part 4: Strength test methods of solder joint of field array type packed surface mounted circuit elements
TS EN 62137-4 / AC Electronic assembly technology - Part 4: Strength test methods of solder joints of field array type packaged surface-mounted circuit elements
TS EN 62739-2 Test method for erosion in corrugated soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for surface treated metal materials
TS EN 62739-3 Test method for erosion in corrugated soldering equipment using molten lead-free solder alloy - Part 3: Erosion test methods selection guide
The test of the solderability of electronic components for surface-mounted elements (smd) by means of the soaking equilibrium method - TS EN 60068-2-69
Environmental testing - Section 60068-2-Tests - Tx test: whisker test methods for electrical and electronic components
TS EN 60917-2-1 Modular layout for the development of mechanical structures in electronic hardware applications Section 2: Section specifications-Interface coordination dimensions for 25 mm hardware application section 1: Detail specifications-Dimensions for cabinets and shelves
TS EN 60917-2-2 Modular layout for the development of mechanical structures in electronic hardware applications Section 2: Section features-Interface coordination dimensions for 25 mm hardware application section 2: Detail specifications-Lower shelves, chassis, rear planes, front panels and plug-in units Dimensions for
TS EN 61163-1 Reliability stress screening - Part 1: Batch repairable materials
TS EN 61188-1-1 Printed circuits and printed circuit groups-Design and use-Part 1-1: General requirements-Flatness assumptions for electronic components
TS EN 61188-1-2 Printed circuits and printed circuit groups-Design and use-Section 1-2: General requirements-Controlled impedance
TS EN 61188-5-1 Printed cards and printed card mounting elements - Design and operation - Part 5-1: Connection (free / contact area) considerations - General rules
TS EN 61188-5-6 Printed circuits and printed circuit assembly - Design and use - Part 5-6: Connection points (ground / node); J pin chip carriers on 4 side
TS EN 61190-1-3 Fastening materials for electronic assembly - Part 1-3: Rules for flux and flux solid soldering for electronic soldering and electronic soldering
TS EN 61192-1 Mastery requirements for soldered electronic components - Part 1: General
TS EN 61192-2 Mastery criteria for soldered electronic assembly - Part 2: Surface mount
TS EN 61192-3 Mastery criteria for soldered electronic assembly - Part 3: Hole mounting
TS EN 61192-4 Mastery criteria for soldered electronic assembly - Part 4: Mounting of inserts
TS EN 61192-5 Master rules for soldered electronic components - Part 5: Reprocessing, replacement and repair of soldered electronic components
TS EN 61193-2 Quality assessment systems - Part 2: Selection and use of sampling plans for the inspection of electronic components and packaging
TS EN 62090 Product package labels for electronic components using barcodes and two-dimensional symbols
TS EN 62137-1-1 Surface mounting technology - Environmental and endurance test methods for surface mounting solder connection - Part 1-1: Tensile strength test
TS EN 62137-1-3 Surface mounting technology - Environmental and endurance test methods for surface mounting solder connection - Part 1-3: Cyclic drop test
TS EN 62421 Electronic joining technology - Electronic modules